Hosting ESREF in this rich environment is a great opportunity since reliability in these particular applications is a very hot topic with strong challenges such as zero ppm failure and harsh environments.
A special session for Nanosatellite reliability is proposed. A — Quality and Reliability assessment techniques and methods for Devices and Systems. Your Name required. Powered by Koha.
Conferences and Meetings on Electronic Engineering
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Bio and Nano Packaging Techniques for Electron Devices
Non-charge-based logic, magnetic logic, spintronics, plasmonics and quantum computing are also of interest. Subsets of key topics include electron device physics, new device applications, technology scaling and integration issues, as well as innovative transistor structures. Reliability assessment of emerging devices are also solicited here, while that for more mature technologies should be submitted to CRY.
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Papers are solicited on devices, structures, and integration for optoelectronics, displays, and imaging systems. Optoelectronics include photonic bandgap structures, light sources, polarization and wavelength manipulators, high speed photodetectors, as well as large scale heterogeneous integration of electronic and photonic circuits and optical interconnects.
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Papers on quantum photonics for computation, sensing and encryption are also of interest. Displays and imagers include CMOS imagers, high speed and high time resolution imagers, CCDs, TFTs, organic, amorphous, and polycrystalline devices, as well as emissive and reflective displays.
Papers are solicited on discrete and integrated power devices and modules using Si, diamond, and compound semiconductors. Papers exploring the system-level impact of power devices are also of interest. Devices targeting the full range of power and power conversion applications, including hybrid and electric vehicles, power supplies for computer and telecom and data centers, motor drives, utility and grid control, and wireless power transfer, are of interest besides fundamental studies on doping, interface state densities and device reliability for power switches.